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  • Introduction
  • CPU Module Overview
  • Product Features and Specifications
  • Module Pinouts
  • Module layout and dimensions
  • Documentation
  • Demo Videos

XENO+ ™ WiFi+BLE5.0 Nano CPU Module


XENO+ WiFi+BLE Nano CPU Module is a solderable module and can be used as core CPU module of new Battery powered IOT devices of customers so that customers can focus only on adding sensors and Battery power circuits around this CPU module for building their new IOT devices in short time.

The module has smallest possible size with secure IoT MCU of Nuvoton ARM Cortex-M23 (M2354) Trust Zone @ 96MHz, 1MB Flash, 256KB SRAM, UART/SPI/I2C ports and GPIOs. This module has USB Type C based 5V Power input with serial debug port and Battery power input options. This module has 3 pin SWD pins for SW development and SW debug via KEIL IDE for Embedded SW development for the device by the users. This Nano module is suitable for Trusted Execution Environment (TEE) with Trusted Applications (TAs). The key security features are,
  • Tamper-resistant key storage in Flash and SRAM,
  • TrustZone for Armv8-M Technology,
  • 8 regions MPU_NS (for normal world) and 8 regions MPU_S (for secure world),
  • Hardware Crypto Accelerators (AES, ECC and RSA), CRC calculation unit,
  • Up to 6 tamper detection pins and
  • Arm Platform Security Architecture (PSA Certified Level 2 /Level 3) supported.

  • This module includes InnoPhase IoT’s Talaria TWO™ certified WiFi and BLE module INP1014, that provides an integrated WiFi b/g/n and BLE 5.0 with a single PCB antenna. The WiFi is a single-band, 2.4 GHz, 802.11 b/g/n solution with WPA2/WPA3 personal and enterprise security certified and capable of delivering 65 Mbps PHY rate. The integrated BLE with Long Range, Extended ADV, and 2 Mbps PHY can be used for device provisioning. The Low Power INP1014 module offers a 50% reduction in cThe platform includes InnoPhase IoT’s Talaria TWO™ certified WiFi and BLE module, INP1014, that provides an integrated WiFi b/g/n and BLE 5.0 with a single PCB antenna. The WiFi is a single-band, 2.4 GHz, 802.11 b/g/n solution with WPA2/WPA3 personal and enterprise security certified and capable of delivering 65 Mbps PHY rate. The integrated BLE with Long Range, Extended ADV, and 2 Mbps PHY can be used for device provisioning. The Low Power INP1014 module offers a 50% reduction in current consumption compared to the competition and is suitable for building high bandwidth, battery-operated solutions.urrent consumption compared to the competition and is suitable for building high bandwidth, battery-operated solutions.

    CPU Module Overview


    The below table shows the brief overview of modules:

    XNO-W102N XNO-W112N
    Module Image dimensions dimensions
    Wireless Interface WiFi 2.4 b/g/n and BLE5.0 WiFi 2.4 b/g/n and BLE5.0
    Antenna PCB Antenna UFL Antenna
    Sensor Interface UART, SPI, I2C, ADC, DAC, PWM and GPIOs UART, SPI, I2C, ADC, DAC, PWM and GPIOs
    Pins 18x18 Castellated Pins 18x18 Castellated Pins
    Size in mm 60 x 35 mm 60 x 35 mm

    Product Features and Specifications:

    The XENO+ ™ module product features and specifications are listed below:

    Table-1: The Product features and specifications


    SI NO Features Description
    Electro – Mechanical specification
    1 Boards Mounting 18x18 Castellated Pins
    2 Wired interface 1x USB Type C for 5V Power and Serial debug UART interface for debug messages and user inputs.
    3 Antenna Chip antenna or UFL connector for external antenna supports 2.4G.
    4 User SW programming 3 pin SWD pins for SW programming and debug via KEIL IDE
    5 Operating temperature -40 ~ + 85 ℃
    6 Operating humidity 95% or less
    7 Size 60 x 35 mm
    8 Weight 7 grams
    Power Specifications
    1 Module input voltage 5V from USB Type C connector
    * MOSFET based switch to auto cut-off battery power when USB 5V is present.
    2 Battery input voltage 2.5V to 5V Battery power from non-rechargeable (or) rechargeable battery. The battery options are listed below:
    * Two 1.5V AA Type Alkaline/Drycell non-rechargeable batteries connected in series for non-restricted transport.
    * 3.6V AA type (Li-SOCl2) non-rechargeable battery for Industrial applications.
    * 4.2V LiFePO4 18650rechargeable battery. The recharging circuit to be added in carrier board by customer.
    WiFi/BLE Specifications
    1 WiFi 2.4GHz b/g/n
    * PCB Antenna or uFL connector for external Antenna.
    2 BLE BLE5.0 with 2Mbps PHY, LE Coded and Extended Advertising
    3 WiFi/BLE Data interface UART based AT command interface (or) SPI based AT Command interface
    4 WiFi Active Mode Power 31mA (Rx Mode @ 1Mbps 802.11b), 178mA (Tx Mode @ 1Mbps 802.11b +17.5dBm)
    5 Wi-Fi Power Save Mode Power at 802.11b, 1Mbps (Clean Environment, @3.3V) 57uA (DTIM10)
    6 Deep Sleep Mode Power (@3.3V, Memory Retained) 11-19uA (RTC, memory retained, depends on amount of SRAM retained)
    7 Module Standby Power X uA (ARM Cortex-M23 in standby and WiFi module is in shut-down mode)
    8 WiFi Power Shutdown WiFi Power can be shut down by MCU GPIO control signal
    9 Antenna PCB Antenna (or) UFL Antenna Connector
    CPU & Other Specifications
    1 CPU ARM Cortex-M23 TrustZone @ 96MHz
    2 Flash Memory 1MB with Preassigned FOTA section
    3 RAM 256KB SRAM
    4 Sensor Interfaces 1x SPI with two chip selects
    3x UART
    2x I2C
    2x CAN
    2x ADC
    2x DAC
    4x PWM
    7x GPIOs
    5 RTOS FreeRTOS
    Module Pinouts:

    This module has 18x18 Castellated pins. The Left side 18 pins mapping and Right side 18 pins mapping are listed below. The MCU port pins can be assigned with 2 predefined module functions: Function-A and Function-B. The users can also map custom functions as per STM32L4 native GPIO functions on these pins.


    MCU Pinouts

    Left side 18 pins connector signals:

    SNO MCU Pins Function A Function B
    1 PC7 SPI1_MISO TM0
    2 PC6 SPI1_MOSI TM1
    3 PA7 SPI1_CLK TM4/TM2
    4 PA6 SPI1_SS TM3/TM5
    5 PA5 CAN0_TXD CAN0_TXD
    6 PA4 CAN0_RXD CAN0_RXD
    7 PA3 GPIO GPIO
    8 PA2 GPIO GPIO
    9 PA1 I2C2_SCL GPIO
    10 PA0 I2C2_SDA GPIO
    11 PC5 UART4_TXD GPIO
    12 PC4 UART4_RXD GPIO
    13 PC3 UART3_TXD GPIO
    14 PC2 UART3_RXD GPIO
    15 PD3 GPIO GPIO
    16 NRST Active LOW RESET signal to MCU. The Push button also asserts RESET signal to LOW.
    17 GND GND pin of module.
    18 VDD_3V3 Regulated 3V3 supply output from module to other circuits of carrier board.

    Right side 18 pins connector signals:

    SNO MCU Pins Function A Function B
    1 PB7 EADC0_CH7 GPIO
    2 PB8 UART0_RXD UART0_RXD
    3 PB9 UART0_TXD UART0_TXD
    4 PB10 I2C1_SDA GPIO
    5 PB11 I2C1_SCL GPIO
    6 PB12 DAC0_OUT SPI0_MOSI
    7 PB13 DAC1_OUT SPI0_MISO
    8 PB14 EADC0_CH14 SPI0_CLK
    9 PB15 EADC0_CH15 SPI0_SS
    10 PA15 GPIO GPIO
    11 PA14 GPIO GPIO
    12 PA13 BPWM1_CH3 GPIO
    13 PA12 BPWM1_CH2 GPIO
    14 PD1 GPIO GPIO
    15 PD2 GPIO GPIO
    16 GND GND pin of module
    17 VBAT Battery supply voltage input to module with 3V to 6V range. If Battery is connected, the module works with this battery supply.
    18 VBUS_5V USB 5V supply voltage output from module to other circuits of carrier board. When USB cable is removed, the module will switch to Battery supply on-the-fly, if battery is connected.

    Module Layout and Dimensions:

    This module layout and dimensions are shown below.

    Module Dimensions (in mm)

    dimensions

    Documentation:

    XENO+ ™ WiFi+BLE5.0 Nano CPU Module Nuvoton Based Datasheet



    XENO+™ WiFi+BLE Nano CPU Module WMD demo video


    Video Description
    This Device detect the Ceramic Thickness of Ceramic Lined Steel pipe, it was developed using XENO+ ™ Nano CPU Module. This was developed for a major MNC Steel Manufacture. This will take the measured data and send it to Cloud Server using WIFI+BLE5.0

    WMD Dashboard demo video


    Video Description

    Our Wear Monitoring Device predict the wear of the ceramic layer up to critical thickness in real time and sent data to IOT Dashboard application . Our IOT Dashboard application will collect the data in real time and plot the data accordingly and notify the user when ceramic layer thickness reaches critical thickness.


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